| Mechanical | Specification |
| Durability (EIA 364-9C) | Up to 100,000 Cycles, <2 milliohm change |
| Operating Temperature | -65°C to 125°C | Wire Size for Crimp & Solder Cup |
| 26 - 30 AWG | |
| Electrical | Specification |
| Resistance (LLCR-EIA 364-23B) | < 8 milliohms |
| Current Rating | 1 Amp nominal for 30°C T∆ with 26 AWG wiring |
| Materials | Specification |
| Mating Pin | Copper alloy, 50μ inch gold plating over nickel |
All specifications subject to change without notice. All dimensions are in [mm]. US Patent No. 6,767,260 & 7,775,841