| Mechanical | Specification |
| Durability (EIA 364-9C) | Up to 100,000 Cycles, <2 milliohm change |
| Operating Temperature | -65°C to 125°C |
| Wire Size for Crimp & Solder Cup | 16 - 20 AWG |
| Electrical | Specification |
| Resistance (LLCR-EIA 364-23B) | < 2 milliohms |
| Current Rating | 12 Amp nominal (dependent upon mounting config., contact density, ambient temp, etc.) |
| Materials | Specification |
| Mating Pin | High conductivity copper alloy, 50μ inch gold plating over nickel |
| Spring Clip | Beryllium Copper, not plated |
All specifications subject to change without notice. All dimensions are in [mm]. US Patent No. 6,767,260